Copolymer and composition for semiconductor lithography and process for producing the copolymer
AssigneeMaruzen Petrochemical Co., Ltd.
InventorsTomo Oikawa, Takayoshi Okada, Masaaki Kudo, Takanori Yamagishi
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AssigneeMaruzen Petrochemical Co., Ltd.
InventorsTomo Oikawa, Takayoshi Okada, Masaaki Kudo, Takanori Yamagishi
Estimating the term…
[Task to be Achieved] To provide a chemically amplified type positive copolymer for semiconductor lithography, which has eliminated the problems of prior art, has a high development contrast, and has excellent resolution in fine-pattern formation; a composition for semiconductor lithography which contains the copolymer; and a process for producing the copolymer. [Means for Achievement] The copolymer for semiconductor lithography according to the present invention is a copolymer which has at least (A) a repeating unit having a structure which has an alkali-soluble group protected by an acid-labile, dissolution-suppressing group, (B) a repeating group having a lactone structure and (C) a repeating group having an alcoholic hydroxyl group and which is characterized by having an acid value of 0.01 mmol/g or less as determined by dissolving the copolymer in a solvent and subjecting the solution to neutralization titration with a solution of an alkali metal hydroxide using Bromothymol Blue as an indicator.
A copolymer for semiconductor lithography, having at least (A) a repeating unit having a structure which has an alkali-soluble group protected by an acid-labile, dissolution-suppressing group, (B) a repeating group having a lactone structure and (C) a repeating group having an alcoholic hydroxyl group, the copolymer being characterized by having an acid value of 0.01 mmol/g or less as determined by dissolving the copolymer in a solvent and subjecting the solution to neutralization titration with a solution of an alkali metal hydroxide using Bromothymol Blue as an indicator.
A copolymer for semiconductor lithography according to [1], wherein the acid-labile, dissolution-suppressing group of the repeating unit (A) is selected from a structure represented by the following formula (L1)
A copolymer for semiconductor lithography according to [2], wherein the repeating unit (A) has a structure represented by the following formula (A)
A copolymer for semiconductor lithography according to any of [1] to [3], wherein the repeating unit (B) has a structure represented by the following formula (B)
A copolymer for semiconductor lithography according to any of [1] to [4], wherein the repeating unit (C) has a structure represented by the following formula (C)
A composition for semiconductor lithography, characterized by comprising at least a copolymer according any of [1] to [5], a radiation-sensitive acid generator and an organic solvent.
A composition for semiconductor lithography according to [6], which is used in dry lithography.
A composition for semiconductor lithography according to [6], which is used in immersion lithography.
A process for producing a copolymer for semiconductor lithography, having at least (A) a repeating unit having a structure which has an alkali-soluble group protected by an acid-labile, dissolution-suppressing group, (B) a repeating group having a lactone structure and (C) a repeating group having an alcoholic hydroxyl group, which process being characterized by dissolving, in an organic solvent, at least one monomer selected from a monomer giving the repeating unit (A), a monomer giving the repeating unit (B) and a monomer giving the repeating unit (C), contacting the resulting solution with water followed by giving rise to phase separation, and, thereafter, copolymerizing the monomers.
A process for producing a copolymer for semiconductor lithography, having at least (A) a repeating unit having a structure which has an alkali-soluble group protected by an acid-dissociable dissolution-suppressing group, (B) a repeating group having a lactone structure and (C) a repeating group having an alcoholic hydroxyl group, which process being characterized by dissolving, in an organic solvent, at least one monomer selected from a monomer giving the repeating unit (A), a monomer giving the repeating unit (B) and a monomer giving the repeating unit (C), contacting the resulting solution with an ion exchange resin, and, thereafter, copolymerizing the monomers.
Dependencies are inferred from the claim text.