Photosensitive resin composition, cured film, protective film, insulating film, semiconductor device and display device using the same
AssigneeSumitomo Bakelite Co., Ltd.
InventorsHiroaki Makabe, Koji Terakawa
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Abstract
A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.
Claims9
A photosensitive resin composition comprising an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more.
Dependencies are inferred from the claim text.