Optical communication module, manufacturing method therefor, and optical transceiver

A manufacturing method of an optical communication module for manufacturing the optical communication module, comprising the sequentially performed steps of:

• (1) mounting a light-emitting element and a light-receiving element on a side surface of a sub-mount substrate and mounting the sub-mount substrate on a printed circuit board such that the light-emitting and -receiving directions of the light-emitting element and light-receiving element are parallel to the printed circuit board;
• (2) aligning an optical waveguide;
• and
• (3) dropping a resin solution on an area of the sub-mount substrate including an optical waveguide end and the light-emitting element or the light-receiving element, and curing the resin solution.

An optical transceiver comprising:

• a printed circuit board;
• a sub-mount substrate in which one or both a light-emitting element and a light-receiving element are mounted on a side surface thereof;
• and
• an optical waveguide provided between the light-emitting element and the light-receiving element so as to be able to be optically coupled with the light-emitting 5 element and the light-receiving element,
• wherein the light-emitting element and the light-receiving element each have structures in which a surface in contact with the substrate and a surface, through which light is emitted or received, are at the top and bottom positions and the light is emitted or received in a direction perpendicular to the mounted substrate,
• the light-emitting element and the light-receiving element are mounted on the printed circuit board with the sub-mount substrate therebetween such that the light-emitting and receiving directions of the elements are not perpendicular to the printed circuit board, and
• the entire sub-mount substrate, the entire light-emitting element, the entire light-receiving element, and ends of the optical waveguide adjacent to the elements are collectively covered by a resin.