Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board
AssigneeKYOCERA Corporation
InventorsKatsura Hayashi, Yutaka Tsukada
Life of this patent
Estimating the term…
Abstract
The present invention provides a method for manufacturing an optical waveguide. The inventive method includes steps of providing a transfer member comprising a transfer sheet and a first metal film. The transfer sheet and the first metal film are detachable from each other. A laminated body made of a core layer disposed between two clad layers is formed on the transfer member. The invention also relates to optical waveguides produced by the inventive process and devices incorporating the optical waveguides of the invention.
Claims27
A method for manufacturing an optical waveguide member, comprising:
- providing a transfer member comprising a transfer sheet and a first metal film, the transfer sheet and the first metal film being detachable from each other;
- forming a first clad layer on the first metal film of the transfer member;
- forming a core layer which allows light to propagate therethrough on the first clad layer;
- forming a second clad layer on the core layer so that the second clad layer covers the core layer to obtain a laminated body comprising the first clad layer, the core layer, and the second clad layer;
- and
- forming a through electrode in the laminated body.
A method for manufacturing an optical circuit board, comprising:
- providing a transfer member comprising a transfer sheet and a first metal film, the transfer sheet and the metal film being detachable from each other;
- forming a first clad layer on the first metal film of the transfer member;
- forming a core layer which allows light to propagate therethrough on the first clad layer;
- forming a second clad layer on the core layer so that the second clad layer covers the core layer to obtain a laminated body comprising the first clad layer, the core layer, and the second clad layer;
- forming a through electrode in the laminated body;
- adhering the laminated body to a circuit board such that the second clad layer faces the circuit board;
- and
- detaching the transfer sheet from the laminated body and the first metal film.
An optical circuit board, comprising:
- a circuit board;
- and
- an optical waveguide member disposed on the circuit board,
- wherein the optical waveguide member comprises
- a first clad layer,
- a second clad layer closer to the circuit board than the first clad layer,
- a plurality of core layers between the first clad layer and the second clad layer, each core layer comprising an inclined surface, and
- a through electrode senetrating the first and the second clad layers, the through electrode being connected to the circuit board,
- wherein an angle α between the inclined surface of each core layer and a surface of the core layer that faces the first clad layer, is equal to or less than 90 degrees, and wherein an area in a cross section of the through electrode is larger at a side of the circuit board than at a side opposite to the circuit board.
An optical waveguide member, comprising:
- a first clad layer;
- a core layer on the first clad layer, the core layer comprising an inclined surface;
- a second clad layer that continuously covers the core layer and the inclined surface;
- and
- a through electrode penetrating the first and the second clad layers;
- wherein an area in a cross section of the through electrode is larger at a side of the second clad layer than at a side of the first clad layer.
Dependencies are inferred from the claim text.