Magnetic head inspection method, magnetic head inspection device, and magnetic head manufacturing method
AssigneeHitachi High-Technologies Corporation
InventorsTSUNEO NAKAGOMI, TERUAKI TOKUTOMI
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AssigneeHitachi High-Technologies Corporation
InventorsTSUNEO NAKAGOMI, TERUAKI TOKUTOMI
Estimating the term…
A magnetic head inspection device inspects the write track width of a thin film magnetic head in a phase as early as possible during the manufacturing process. A recording signal (excitation signal) is input from bonding pads to the thin film magnetic head in a rowbar, and the magnetic field generated by the write pole (element) included in the thin film magnetic head is observed directly by using a magnetic force microscope (MFM), a scanning Hall probe microscope (SHPM), or a scanning magneto resistance effect microscope (SMRM) that performs a scanning motion at a position equivalent to the flying height of the magnetic head. In this manner, a shape of the generated magnetic field instead of the physical shape of the write pole (element) is measured; thus, a non-destructive inspection can be performed on the effective magnetic track width.
A magnetic head inspection method, adapted to inspect characteristics of a magnetic head in a rowbar shape sliced from a wafer, wherein
A magnetic head inspection method, adapted to inspect characteristics of a magnetic head in a rowbar shape sliced from a wafer, wherein
A magnetic head inspection method, wherein
A magnetic head inspection device, adapted to inspect characteristics of a magnetic head in a rowbar shape sliced from a wafer, comprising:
A magnetic head inspection device, adapted to inspect characteristics of a magnetic head in a rowbar shape sliced from a wafer, comprising:
A magnetic head manufacturing method, adapted to manufacture a magnetic head by following processes, comprising:
A magnetic head manufacturing method, adapted to manufacture a magnetic head by following processes, comprising:
A magnetic head manufacturing method, adapted to manufacture a magnetic head by following processes, comprising:
Dependencies are inferred from the claim text.