System and Method for on-machine 3-D depth measurement
AssigneeChung Yuan Christian University
InventorsShih-Ming Wang, Han-Jen Yu
Life of this patent
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Abstract
The present invention provides a method and system for on-machine 3-D depth measurement. The same image retrieving apparatus measures the first distance for the width of the similar gray-level region of cutting-surface from the first angle, and measures the second distance for the width of the similar gray-level region of cutting-surface from the first angle superimposing the second angle. The width of the similar gray-level region of cutting-surface comprises the cutting-surface and the shadow of the bottom portion of the cutting-surface. And then the cutting-surface depth is calculated according to the first angle, the second angle, the first distance, and the second distance.
Claims18
A method for on-machine 3-D depth measurement, comprising:
- measuring a first distance for a width of an similar gray-level region of cutting-surface from a first angle, wherein the width of the similar gray-level region of cutting-surface comprises a shadow of the cutting-surface and a bottom portion of the cutting-surface;
- measuring a second distance for the width of the similar gray-level region of cutting-surface from the first angle superimposing a second angle;
- calculating an cutting-surface depth according to the first angle, the second angle, the first distance, and the second distance.
A system for on-machine 3-D depth measurement, comprising:
- an object, comprising an cutting-surface;
- a light source above the cutting-surface, illuminating on the cutting-surface to generate a width of an similar gray-level region of cutting-surface;
- an image retrieving apparatus, retrieving a first image and a second image fir th cutting-surface from a first angle and the first angle superimposing a second angle respectively;
- and
- an image measurement apparatus, measuring a first distance and a second distance of the width of the cutting-surface similar gray-level region for the first image and the second image, and calculating an cutting-surface depth according to the first angle, the second angle, the first distance, and the second distance.
Dependencies are inferred from the claim text.