Chip-on-glass panel device
AssigneeHimax Technologies Limited
InventorTzong-Yau Ku
Life of this patent
Estimating the term…
Abstract
A chip-on-glass panel device includes a glass substrate having a pixel area, an integrated circuit area, and a fan out area, the fan out area located between the pixel area and the IC area, a plurality of integrated circuit devices arranged within the integrated area of the glass substrate, each of the plurality of integrated circuit devices have an active surface, a plurality of output pads, each arranged on the active surface, and a plurality of signal pads/gamma pads, each arranged on the active surface, and a plurality of signal wires/gamma wires, each having a curved shape geometry and disposed within the fan out area, for connecting the plurality of signal pads/gamma pads of adjacent ones of the plurality of integrated circuit devices through the fan out area.
Claims21
A chip-on-glass panel device, comprising:
- a glass substrate having a pixel area, an integrated circuit area, and a fan out area, the fan out area located between the pixel area and the IC area;
- a plurality of integrated circuit devices arranged within the integrated area of the glass substrate, each of the plurality of integrated circuit devices comprise:
- an active surface;
- a plurality of output pads, each arranged on the active surface;
- and
- a plurality of signal pads/gamma pads, each arranged on the active surface;
- and
- a plurality of signal wires/gamma wires, each having a curved shape geometry and disposed within the fan out area, for connecting the plurality of signal pads/gamma pads of adjacent ones of the plurality of integrated circuit devices through the fan out area.
A chip-on-glass panel device, comprising:
- a glass substrate having a pixel area, an integrated circuit area, and a fan out area, the fan out area located between the pixel area and the integrated circuit area;
- a plurality of integrated circuit devices arranged within the integrated circuit area of the glass substrate, each of the plurality of integrated circuit devices comprises:
- an active surface;
- a plurality of output pads arranged on the active surface;
- a die attach adhesive bonding the integrated circuit devices on the glass;
- and
- a plurality of signal pads/gamma pads arranged on the active surface;
- and
- a plurality of signal wires/gamma wires, each having a curved shape geometry and disposed within the fan out area, for connecting the plurality of signal pads/gamma pads of adjacent ones of the plurality of integrated circuit devices.
Dependencies are inferred from the claim text.