Balun circuit manufactured by integrate passive device process

A Balun circuit manufactured by integrate passive device (IPD) process, the Balun circuit comprises:

• a substrate;
• a first coplanar spiral structure having a first end, a second end, a first connecting line, a second connecting line, a plurality of first left half coils, a plurality of first right half coils, and at least one first intersecting structure, wherein at least two first left half coils are electrically connected to the corresponding two first right half coils through one first intersecting structure, the first end is electrically connected to the outermost first left half coil through the first connecting line, and the second end is electrically connected to the outermost first right half coil through the second connecting line;
• and
• a second coplanar spiral structure having a third end, a fourth end, a third connecting line, a fourth connecting line, a plurality of second left half coils, a plurality of second right half coils, and at least one second intersecting structure, wherein at least two second left half coils are electrically connected to the corresponding two second right half coil through one second intersecting structure, the third end is electrically connected to the innermost second left half coil through the third connecting line, the fourth end is electrically connected to the innermost second right half coil through the fourth connecting line;
• wherein the first left half coils and the second left half coils are interlaced, and so are the first right half coils and the second right half coils interlaced.