Back to results
US 2010/0059898 A1Published application
Signal delivery in stacked device
AssigneeMicron Technology, Inc.
InventorsBrent Keeth, Mark Hiatt, Terry R. Lee, Mark Tuttle, Rahul Advani, John F. Schreck
Life of this patent
Estimating the term…
Abstract
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
Claims43
An apparatus comprising:
- a base configured to receive signals;
- a first die including conductive paths at least partly through the first die;
- a second die arranged in a stack with the first die and the base;
- and
- a structure located in the stack and outside at least one of the first die and the second die and configured to transfer at least one subset of the signals between the base and at least one of the first die and the second die.
2 more elements
An apparatus comprising:
- a base configured to receive signals;
- and
- a first device including first conductive paths at least partly through the first device;
- a second device;
- and
- an interposer arranged in a stack with the base, the first device, and the second device, the interposer being located between the first and second devices and configured to transfer at least one subset of the signals to one of the first and second devices, the interposer including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the first device, second conductive contacts located at the second surface and coupled to the second device, and second conductive paths coupling the first conductive contacts to the second conductive contacts.
3 more elements
An apparatus comprising:
- a base configured to receive signals;
- and
- a first device including first conductive paths at least partly through the first device;
- a second device arranged in a stack with the base and the first device, the first device being located between the base and the second device, the first device having a length less than a length of the second device;
- and
- a structure configured to transfer at least one subset of the signals to the second device, the structure including a first structure portion located at a first side of the first device and a second structure portion located at a second side of the first device, each of the first and second structure portions including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the base, second conductive contacts located at the second surface and coupled to the second device, and second conductive paths coupling the first conductive contacts to the second conductive contact.
3 more elements
An apparatus comprising:
- a base configured to receive signals;
- and
- a first device including conductive paths at least partly through the first device;
- a second device including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the first device, and second conductive contacts located at the second surface;
- and
- a structure including conductive paths configured to transfer at least one subset of the signals to the second device, the structure including a first structure portion arranged in a stack with the base, the first device, and the second device, the first and second devices being between the base and the first structure portion.
3 more elements
A system comprising:
- a processor;
- a memory device enclosed in an integrated circuit package with the processor and including a die with conductive paths at least partly through the die;
- a base arranged in a stack with the memory device and the processor and configured to receive signals;
- and
- a structure located in the stack and outside at least one of the processor and the memory device and configured to transfer at least one subset of the signals between the base and at least one of the processor and the memory device.
2 more elements
A method comprising:
- receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
- and
- transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside at least one of the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure.
A method comprising:
- arranging a first device in a stack with a second device, the first device including at least one conductive path at least partly through the first device;
- and
- arranging a structure in the stack to transfer at least one subset of signals between a base and at least one of the first and second devices, the structure including conductive paths to transfer the signals, at least a portion of the conductive paths going through vias of the structure.
Dependencies are inferred from the claim text.