Coplaner waveguide and fabrication method thereof
AssigneeOki Electric Industry Co., Ltd.
InventorsTakeshi Makita, Isao Tamai, Shinichi Hoshi
Life of this patent
Estimating the term…
Abstract
A coplanar waveguide includes a substrate, a signal line formed on the substrate, a pair of ground conductors formed on the substrate on mutually opposite sides of the signal line, a signal line insulating film disposed between the signal line and the substrate, and a ground conductor insulating film disposed between the pair of ground conductors and the substrate. No corresponding insulating film is present on the substrate between the signal line and the ground conductors. Even if a silicon substrate is used, the attenuation characteristics of the coplanar waveguide are comparable to the attenuation characteristics of coplanar waveguides formed on compound semiconductor substrates.
Claims18
A coplanar waveguide comprising:
- a substrate having a major surface;
- a signal line formed on the substrate;
- a pair of ground conductors formed on the major surface of the substrate on mutually opposite sides of the signal line;
- a signal line insulating film disposed between the signal line and the substrate;
- and
- a ground conductor insulating film disposed between the pair of ground conductors and the substrate.
A method of fabricating a coplanar waveguide, comprising:
- forming an insulating film on a major surface of a substrate;
- forming a signal line and a pair of ground conductors on the insulating film, the signal line being formed between the ground conductors;
- and
- removing the insulating film between the signal line and the ground conductors using the signal line and the ground conductors as a mask.
Dependencies are inferred from the claim text.