Leadless semiconductor chip carrier system
AssigneeSTATS ChipPAC, Ltd.
InventorsHeap Hoe Kuan, Rui Huang, Seng Guan Chow
Life of this patent
Estimating the term…
Abstract
A semiconductor package system includes: providing a semiconductor die with bonding pad on the semiconductor die; attaching the semiconductor die to an intermediate layer; attaching one end of a bonding wire to the bonding pad; forming a bonding ball at the other end of the bonding wire, the bonding ball being fully or partially embedded in the intermediate layer; encapsulating the semiconductor die, the bonding pad, the bonding wire, and a portion of the bonding ball with a mold compound; removing the intermediate layer, resulting in the bonding ball protruding from the exposed mold compound bottom surface; and conditioning the bonding ball
Claims20
A semiconductor package system comprising:
- providing a semiconductor die with bonding pad on the semiconductor die;
- attaching the semiconductor die to an intermediate layer;
- attaching one end of a bonding wire to the bonding pad;
- forming a bonding ball at the other end of the bonding wire, the bonding ball being fully or partially embedded in the intermediate layer;
- encapsulating the semiconductor die, the bonding pad, the bonding wire, and a portion of the bonding ball with a mold compound;
- removing the intermediate layer, resulting in the bonding ball protruding from the exposed mold compound bottom surface;
- and
- conditioning the bonding ball.
A semiconductor package system comprising:
- providing a semiconductor die with bonding pad on the semiconductor die;
- attaching the semiconductor die to a penetrable layer and further attaching the penetrable layer to a support layer;
- attaching one end of a bonding wire to the bonding pad;
- forming a bonding ball at the other end of the bonding wire, the bonding ball being fully or partially embedded in the penetrable layer;
- encapsulating the semiconductor die, the bonding pad, the bonding wire, and a portion of the bonding ball with a mold compound;
- removing the penetrable layer and the support layer, resulting in the bonding ball protruding from the exposed mold compound bottom surface;
- conditioning the bonding ball;
- attaching solder ball;
- and
- performing a singulation process.
A semiconductor package system comprising:
- a die;
- a bonding pad on the die;
- a bonding wire with one end attached to the bonding pad;
- a conditioned bonding ball formed at the other end of the bonding wire;
- and
- a mold compound encapsulating the die, the bonding pad, the bonding wire, and a portion of the bonding ball, the bonding ball protruding from the exposed mold compound bottom surface.
Dependencies are inferred from the claim text.