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US 2010/0059883 A1Published application
Method of forming ball bond
AssigneeFreescale Semiconductor, Inc.
InventorsKai Yun Yow, Eu Poh Leng
Life of this patent
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Abstract
A method of forming a ball bond (10) includes forming a bonding ball (12) at an end of a bonding wire (16). The bonding ball (12) is preformed to a substantially ball bond shape at a preform location (14) remote from a bonding site (24). The preformed bonding ball (22) is subsequently bonded to the bonding site (24).
Claims20
A method of forming a ball bond, comprising:
- forming a bonding ball at an end of a bonding wire;
- preforming the bonding ball to a substantially ball bond shape at a preform location remote from a bonding site;
- and
- bonding the preformed bonding ball to the bonding site.
1 more element
A method of forming a ball bond, comprising:
- forming a bonding ball at an end of a bonding wire;
- deforming the bonding ball against a first surface;
- removing the deformed bonding ball from the first surface;
- and
- bonding the deformed bonding ball to a second surface, wherein the second surface is adjacent to the first surface.
2 more elements
A semiconductor package, comprising:
- a die carrier having a plurality of bonding sites;
- an integrated circuit (IC) die attached to the die carrier, the IC die having a plurality of first connection pads and a plurality of second connection pads, wherein indentation marks are formed on the first connection pads;
- and
- a plurality of wires electrically connecting the bonding sites on the die carrier to the second connection pads on the IC die, wherein the wires include preformed ball bonds for the connections of the wires to the second connection pads.
1 more element
Dependencies are inferred from the claim text.