Semiconductor module and an electronic system including the same
AssigneeSamsung Electronics Co., Ltd.
InventorJoong-Hyun BAEK
Life of this patent
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Abstract
A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.
Claims20
A semiconductor module to connect to a main circuit board of an electronic system, comprising:
- a module substrate;
- a logic device formed on a part of the module substrate;
- and
- a plurality of memory devices formed on another part of the module substrate,
- wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter.
An electronic system, comprising:
- a main circuit board;
- a semiconductor module socket formed on the main circuit board;
- and
- a semiconductor module formed on the main circuit board, wherein the semiconductor module comprises:
- a module substrate;
- a logic device formed on a part of the module substrate;
- and
- a plurality of memory devices formed on another part of the module substrate,
- wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter, and
- wherein the semiconductor module is electrically connected to the main circuit board through the semiconductor module socket.
A semiconductor module having a connection unit to connect to an electronic circuit board, the semiconductor module comprising:
- a module substrate;
- a logic device disposed on a first surface of the module substrate;
- a plurality of memory devices disposed on at least a second surface opposite the first surface of the module substrate;
- and
- at least one supporter on the first surface of the module substrate to support at least a portion of the module substrate.
An electronic system, comprising:
- an electronic circuit board;
- a connection unit disposed on the electronic circuit board;
- a semiconductor module connected to the connection unit, having:
- a module substrate;
- a logic device disposed on a first surface of the module substrate;
- a plurality of memory devices disposed on at least a second surface opposite the first surface of the module substrate;
- and
- at least one supporter on the first surface of the module substrate to support at least a portion of the module substrate.
Dependencies are inferred from the claim text.