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US 2010/0059877 A1Published application
Method for packaging electronic devices and integrated circuits
AssigneeSchott AG
InventorsJuergen Leib, Hidefumi Yamamoto
Life of this patent
Estimating the term…
Abstract
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits.
Claims21
A method for packaging electronic components comprising:
- a) providing at least one support substrate (1),
- b) producing at least one recess (7) in a top side (1a) of said support substrate (1) comprising at least one stair (11),
- c) placing at least one first electronic device (61) at least partially onto said stair (11) to space said first electronic device (61) from a bottom (71) of said recess (7) and
- d) covering at least partially said top side (1a) of said support substrate (1) with a lid (4).
1 more element
4-30. (canceled)
A method for packaging electronic components comprising:
- a) providing at least one support substrate (1),
- b) producing at least one recess (7) in a top side (1a) of said support substrate (1),
- c) placing at least one first electronic device (61) into said recess (7),
- d) arranging at least one second electronic device (62) on said top side (1a) of said support substrate (1), and
- e) covering at least partially said top side (1a) of said support substrate (1) with a lid (4).
2 more elements
An electronic package (20) comprising:
- a) at least one support substrate (1) having at least one recess (7) in a top side (1a) wherein said recess (7) comprises at least one stair (11),
- b) at least one first electronic device (61) arranged at least partially onto said stair (11) spacing said first electronic device (61) from the bottom (71) of said recess (7), and
- c) a lid (4) covering at least partially said top side (1a) of said support substrate (1).
An electronic package (20) comprising:
- a) at least one support substrate (1) having at least one recess (7) in a top side (1a)
- b) at least one first electronic device (61) arranged within said recess (7),
- c) at least one second electronic device (62) arranged on said top side (1a) of said support substrate (1), and
- d) a lid (4) covering at least partially said top side (1a) of said support substrate (1).
1 more element
Dependencies are inferred from the claim text.