Electronic component package and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsHiroshi Shimizu, Hiroyuki Kato, Takahiro Takenouchi
Life of this patent
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Abstract
There is provided an electronic component package. The electronic component package includes: a core layer including a plurality of insulating layers formed by impregnating a base material with a resin, wherein a hollow portion is formed in the core layer; core wiring layers each disposed between the insulating layers; and an electronic component disposed in the hollow portion. The electronic component and the core wiring layer are electrically connected to each other by a bonding wire.
Claims7
An electronic component package comprising:
- a core layer including a plurality of insulating layers formed by impregnating a base material with a resin, wherein a hollow portion is formed in the core layer;
- core wiring layers each disposed between the insulating layers;
- and
- an electronic component disposed in the hollow portion,
- wherein the electronic component and the core wiring layer are electrically connected to each other by a bonding wire.
A method of manufacturing an electronic component package, the method comprising:
- (a) providing a first insulating layer formed by impregnating a base material with a resin;
- (b) forming conductive layers on upper and lower surfaces of the first insulating layer;
- (c) forming a through-hole in the first insulating layer;
- (d) forming a via in the through-hole;
- (e) forming wiring patterns on the conductive layer formed on the upper surface of the first insulating layer;
- (f) forming a first opening in the first insulating layer;
- (g) patterning the conductive layers, thereby forming wiring layers;
- (h) forming a second insulating layer, formed by impregnating a base material with a resin, on the upper surface of the first insulating layer;
- (i) forming a second opening in the second insulating layer such that the second opening is larger than the first opening and such that a center of the second opening coincides with that of the first opening;
- (j) forming a third insulating layer, formed by impregnating a base material with a resin, on the lower surface of the first insulating layer;
- (k) heating and pressurizing the first insulating layer, the second insulating layer and the third insulating layer, thereby integrating the first insulating layer, the second insulating layer and the third insulating layer;
- (l) housing an electronic component in the first opening such that the electronic component is mounted on the third insulating layer exposed from the second insulating layer;
- and
- (m) electrically connecting the electronic component to the wiring layer formed on the upper surface of the first insulating layer, by a bonding wire.
Dependencies are inferred from the claim text.