Back to results
US 2010/0059873 A1Published application
Ball grid array package stacking system
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Lionel Chien Hui Tay
Life of this patent
Estimating the term…
Abstract
A ball grid array package stacking system includes: forming a heat spreader having a centrally located access port; mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port; coupling an integrated circuit die to the substrate; and coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof.
Claims20
A ball grid array package stacking system comprising:
- forming a heat spreader having a centrally located access port;
- mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port;
- coupling an integrated circuit die to the substrate;
- and
- coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof.
2 more elements
A ball grid array package stacking system comprising:
- forming a heat spreader having a centrally located access port including forming a standoff leg;
- mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port including forming an array of the connection pads;
- coupling an integrated circuit die to the substrate including connecting an electrical interconnect between the integrated circuit die and the substrate;
- and
- coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof including coupling a solder ball, a solder bump, a solder column, or a stud bump.
2 more elements
A ball grid array package stacking system comprising:
- a heat spreader having a centrally located access port;
- a substrate mounted in the heat spreader for providing a connection pad in the centrally located access port;
- an integrated circuit die coupled to the substrate;
- and
- a system interconnect coupled to the integrated circuit die, the connection pad, or a combination thereof.
2 more elements
Dependencies are inferred from the claim text.