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US 2010/0059872 A1Published application
Adhesive Tape, Connected Structure and Semiconductor Package
AssigneeSumitomo Bakelite Co., Ltd.
InventorSatoru Katsurayama
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Abstract
An adhesive tape 101 electrically connecting conductive components includes a resin layer 132 containing a thermosetting resin, a solder powder 103 and a curing agent. The solder powder 103 and the curing agent reside in the resin layer 132, the curing temperature T1 of the resin layer 132 and the melting point T2 of the solder powder 103 satisfy T1≧T2+20° C., wherein the resin layer 132 shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T2 of the solder powder 103.
Claims11
An adhesive tape electrically connecting conductive components, comprising:
- a resin layer containing a thermosetting resin;
- a solder powder;
- and
- a curing agent,
- wherein said solder powder and said curing agent reside in said resin layer,
- the curing temperature T1 of said resin layer and the melting point T2 of said solder powder satisfy the relational expression (1):
- T1≧T2+20° C. expression (1)
- where said curing temperature T1 is defined as an exothermic peak temperature obtained by measuring said adhesive tape by DSC at a temperature elevation speed of 10° C./minute, and
- said resin layer shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T2 of said solder powder.
6 more elements
Dependencies are inferred from the claim text.