Package with Power and Ground Through Via

A wire bond design package substrate, comprising:

• a substrate having a front side and a back side,
• a die attach pad disposed on the front side of the substrate, the die attach pad substantially covered with electrically conductive surfaces, the electrically conductive surfaces including at least one power surface and at least one ground surface,
• electrically conductive bonding fingers disposed outside of the die attach pad on the front side,
• electrical connections disposed on the back side, and
• electrically conductive traces disposed between the front side and the back side, the electrically conductive traces electrically connecting the bonding fingers and the electrically conductive surfaces on the front side to the electrical connections on the back side.

A packaged integrated circuit, comprising:

• a wire bond design integrated circuit, comprising:
• an integrated circuit substrate having a front side and an opposing back side,
• circuitry disposed on the font side of the integrated circuit substrate,
• electrically conductive vias disposed through the integrated circuit substrate from the front side of the integrated circuit substrate to the back side of the integrated circuit substrate, the electrically conductive vias electrically connected to the circuitry such that the electrically conductive vias provide power and ground services only for the circuitry, and
• bonding pads disposed on the front side of the integrated circuit substrate, the bonding pads electrically connected to the circuitry such that the bonding pads provide signal communication only for the circuitry,
• a wire bond design package substrate, comprising:
• a package substrate having a front side and a back side,
• a die attach pad disposed on the front side of the package substrate, the die attach pad substantially covered with electrically conductive surfaces, the electrically conductive surfaces including at least one power surface and at least one ground surface, where the electrically conductive surfaces of the wire bond design package substrate make electrical connections with the electrically conductive vias of the wire bond design integrated circuit,
• electrically conductive bonding fingers disposed outside of the die attach pad on the front side of the package substrate,
• electrical connections disposed on the back side of the package substrate, and
• electrically conductive traces disposed between the front side of the package substrate and the back side of the package substrate, the electrically conductive traces electrically connecting the bonding fingers and the electrically conductive surfaces on the front side of the package substrate to the electrical connections on the back side of the package substrate, and
• electrically conductive bonding wires forming electrical connections between the bonding pads and the bonding fingers.