Integrated capacitors in package-level structures, processes of making same, and systems containing same
AssigneeIntel Corporation
InventorsJohn J. Tang, Xiang Yin Zeng, Jiangqi He, Ding Hai
Life of this patent
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Abstract
An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
Claims14
An article comprising:
- a bottom electrode;
- a dielectric film including a first surface and a second surface, wherein the dielectric film is disposed above and on the bottom electrode;
- a structural layer disposed adjacent and in contact with the dielectric film, wherein the structural layer is substantially coplanar with the dielectric film on at least one of the first surface and the second surface, and wherein the structural layer is at least one of a solder mask and a core layer;
- and
- a top electrode disposed above and on the dielectric film.
9-17. (canceled)
A system comprising:
- a bottom electrode;
- a dielectric film including a first surface and a second surface, wherein the dielectric film is disposed above and on the bottom electrode;
- a structural layer disposed adjacent and in contact with the dielectric film, wherein the structural layer is substantially coplanar with the dielectric film on at least one of the first surface and the second surface, and wherein the structural layer is at least one of a solder mask and a core layer;
- a top electrode disposed above and on the dielectric film;
- a die coupled to the top electrode;
- and
- dynamic random-access memory coupled to the die.
The system of claim 9, wherein the die is disposed in a solder-mask layer.
The system of claim 9, wherein the structural layer is a core layer, and further including a plated through-hole disposed adjacent the dielectric film, and spaced apart from the dielectric film by the core layer.
The system of claim 9, wherein the system is disposed in one of a computer, a wireless communicator, a hand-held device, an automobile, a locomotive, an aircraft, a watercraft, and a spacecraft.
The system of claim 9, wherein the die is selected from a data storage device, a digital signal processor, a micro controller, an application specific integrated circuit, and a microprocessor.
Dependencies are inferred from the claim text.