Semiconductor light-emitting apparatus
AssigneeShowa Denko K.K.
InventorTakaharu Hoshina
Life of this patent
Estimating the term…
Abstract
An object of the present invention is to provide a light-emitting apparatus reduced in the optical self-absorption of the light-emitting device and assured of excellent light extraction efficiency. The inventive light-emitting apparatus comprises a substrate, a semiconductor light-emitting device provided on the substrate with or without intervention of a submount, and an encapsulating structure for encapsulating the semiconductor light-emitting device, wherein the encapsulating structure has a bottom parallel to the bottom of the semiconductor light-emitting device and the side surface of the encapsulating structure is tilted with respect to the bottom.
Claims13
A light-emitting apparatus comprising a substrate, a semiconductor light-emitting device provided on the substrate with or without intervention of a submount, and an encapsulating structure for encapsulating the semiconductor light-emitting device, wherein the encapsulating structure has a bottom parallel to the bottom of the semiconductor light-emitting device and the side surface of the encapsulating structure is tilted with respect to the bottom.
A production method of a light-emitting apparatus, comprising the following steps (1) to (4):
- (1) a step of mounting a semiconductor light-emitting device on a substrate with or without intervention of a submount,
- (2) a step of forming a hollow-centered ring-like tapered tube with the top and bottom satisfying the shapes of the top and bottom of the encapsulating structure according to any one of items 5 to 10 above,
- (3) a step of mounting the ring-like tapered tube on the substrate so that the semiconductor device and, if desired, the submount can fit into the center hollow part, and
- (4) a step of packing a material having the same refractive index as that of the ring-like tapered tube in the center hollow part of the ring-like tapered tube.
A production method of a light-emitting apparatus, comprising the following steps (1) to (3):
- (1) a step of mounting a semiconductor light-emitting device on a substrate with or without intervention of a submount,
- (2) a step of forming an encapsulating structure having a recess in the center part of the bottom, with the top and bottom satisfying the shapes according to any one of items 5 to 10 above, and
- (3) a step of fastening the encapsulating structure to the substrate with a material having the same refractive index as that of the encapsulating structure so that the semiconductor device and, if desired, the submount can fit into the recess, and at the same time, packing the material in the recess.
Dependencies are inferred from the claim text.