Package Method and Structure for a Light Emitting Diode Multi-Layer Module

A package method for a light emitting diode multi-layer module, comprising the steps of:

• fabricating a printed circuit layer on a substrate;
• fabricating a frame and a protruding inclined pier:
• fixing a frame around the substrate, and around a bottom rim of an inner wall of the frame is disposed a protruding inclined pier;
• fabricating reflecting microstructure points:
• fabricating a plurality of reflecting microstructure points on a surface of the printed circuit layer;
• positioning chips and wire bonding;
• dispensing:
• filling a silica gel diffusion layer into the frame;
• and
• fabricating a fluorescent glue layer:
• coating an even fluorescent glue layer on a surface of the silica gel diffusion layer.

A package method for a light emitting diode multi-layer module, comprising the steps of:

• fabricating a printed circuit layer on a substrate, fabricating a plurality of staggered nodes on the printed circuit layer;
• fabricating a frame and an inclined pier:
• fixing a fame around the substrate, and fabricating a protruding inclined pier around a bottom rim of an inner wall of the frame;
• fabricating convex reflecting microstructure points:
• fabricating a plurality of convex reflecting microstructure points on a surface of the printed circuit layer, and the respective convex reflecting microstructure points are correspondingly disposed between the plurality of nodes;
• positioning chips and wire bonding;
• spraying paint:
• precisely spraying reflecting paint on predetermined elements, excluding the chips;
• dispensing:
• filling a silica gel diffusion layer into the frame;
• and
• fabricating a fluorescent glue layer:
• coating an even fluorescent glue layer on a surface of the silica gel diffusion layer.