Device and method for selective soldering
AssigneeLinde Atkiengesellschaft
InventorsHans Isler, Ernst Wandke
Life of this patent
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Abstract
The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood.
Claims11
A device for selective soldering, comprising a container for liquid solder which contains a soldering bath, a soldering channel, at least one nozzle mounted on the soldering channel, a vertically moveable hood surrounding the soldering channel and which is immerseable in the soldering bath or which is sealed against a surface of the soldering bath, the hood comprising a passage for each nozzle, a space underneath the hood for at least one gas feeding device for providing at least one of protective and active gas, and flow sheets which are attached to the hood and extend substantially downward in the direction of the soldering bath from the hood.
5-8. (canceled)
A method for selective soldering, comprising:
- positioning a printed circuit board above a hood at a solder bath, the hood having a passage therein for the printed circuit hood;
- moving the printed circuit board and the hood to be exposed to the solder bath, the hood sealing against the solder bath for providing a space beneath the hood for solder;
- providing the solder through the passage to the printed circuit board and providing inerting gas to the space beneath the hood;
- and
- removing the hood with printed current board from the solder bath when the soldering is complete.
Dependencies are inferred from the claim text.