Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJong-Jin LEE
Life of this patent
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Abstract
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer.
Claims4
A method of manufacturing a printed circuit board, the method comprising:
- providing a pair of conductive layers, roughness of one surface of one of the pair of conductive layers being different from roughness of one surface of the other of the pair of conductive layers;
- and
- stacking the pair of conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer.
A printed circuit board comprising:
- a dielectric layer being made of a material including epoxy resin;
- and
- a pair of copper foil films being stacked on the dielectric layer such that one surface of one of the pair of copper foil films faces one surface of the dielectric layer and one surface of the other of the pair of copper foil films faces another surface of the dielectric layer, roughness of one surface of one of the pair of copper foil films being different from roughness of one surface of the other of the pair of copper foil films.
Dependencies are inferred from the claim text.