Ceramic multi-layer circuit substrate and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWon Hee YOO, Byeung Gyu CHANG, Taek Jung LEE, Yong Suk KIM
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Abstract
Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
Claims8
A method of manufacturing a ceramic multi-layer circuit substrate, comprising:
- forming a plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other;
- firing the ceramic blocks;
- aligning the fired ceramic blocks with each other;
- preparing one or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks;
- interposing each of the bonding green sheets between a pair of the ceramic blocks opposing each other;
- and
- bonding the ceramic blocks and the bonding green sheets with each other, followed by firing a resultant structure.
A ceramic multi-layer circuit substrate comprising:
- a plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other;
- and
- one or more bonding green sheets, each of which is interposed between a pair of the ceramic blocks opposing each other and has bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks.
Dependencies are inferred from the claim text.