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AssigneeAT & S Austria Technologie & Systemtecknik Aktiengesellschaft
InventorsGerald Weidinger, Markus Leitgeb, Johannes Stahr, Günther Weichslberger, Andreas Zluc
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The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
1-21. (canceled)
A method for removing a subportion or part of a substantially flat or planar material layer which is bonded with at least one further substantially flat or planar material layer in a bonding procedure, wherein, in the region or zone of the subsequent removal of the subportion, an area kept free from direct bonding between the material layers is provided by applying a material preventing the adhesion of the material layers to be bonded and wherein the substantially flat material layers to be bonded are formed by layers of a multilayer printed circuit board, wherein, in the region of the subsequent removal of the subportion, a waxy paste is applied between the material layers to be bonded and that the wax of the adhesion-preventing material has a softening or melting point of at least 100° C. and, in particular, 120° C.
A multilayer structure formed by at least two substantially flat or planar material layers to be bonded with each other, wherein, in the region of a subportion or part to be removed after having realized the bonding between the material layers, an area kept free from direct bonding between the material layers to be bonded is provided by the application of a material preventing the adherence of the material layers to be bonded and wherein the substantially flat material layers to be bonded are formed by layers of a multilayer printed circuit board, wherein the adhesion-preventing material is comprised of a wax paste and that the wax of the adhesion-preventing material has a softening or melting point of at least 100° C. and, in particular, 120° C.
Dependencies are inferred from the claim text.