Loading patent…
AssigneeSeiko Epson Corporation
InventorsKiyohiko Takemoto, Miharu Kanaya
Estimating the term…
Objects of the present invention include providing composite metallic thin filmy particles for conductive inks and a conductive ink, both allowing the production of highly conductive substrates with simpler equipment and at a lower cost, providing a method for making such a conductive substrate, and providing such a conductive substrate. The present invention includes Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic thin filmy particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.
A composite metallic thin filmy particle made in steps including Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains a resin layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet.
A composite metallic thin filmy particle made in steps including Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains a wax layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet.
A method for making a conductive substrate comprising Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer, Step 2 for making a composite metallic thin filmy particle by removing the composite metallic thin film layer from the sheet, Step 3 for making a dispersion of a composite metallic thin filmy particle by dispersing the composite metallic thin filmy particle in a liquid, Step 4 for conditioning an ink for making a conductive substrate, the ink containing at least the dispersion of a composite metallic thin filmy particle, and Step 5 for forming a patterned conductive layer using the ink for making a conductive substrate.
A method for making a conductive substrate comprising Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer, Step 2 for making a composite metallic thin filmy particle by removing the composite metallic thin film layer from the sheet, Step 3 for making a dispersion of a composite metallic thin filmy particle by dispersing the composite metallic thin filmy particle in a liquid, Step 4 for conditioning an ink for making a conductive substrate, the ink containing at least the dispersion of a composite metallic thin filmy particle, and Step 5 for forming a patterned conductive layer using the ink for making a conductive substrate by an ink jet method.
Dependencies are inferred from the claim text.