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US 2010/0059244 A1Published application
Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus
AssigneeKYOCERA Corporation
InventorItaru Ishii
Life of this patent
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Abstract
The invention relates to a microstructure apparatus. A microstructure apparatus according to one of the invention includes a first substrate having a surface on which a microstructure is disposed; a second substrate having a surface opposing the microstructure; and a sealing member that bonds the opposing surfaces of the first substrate and the second substrate and that encloses and seals the microstructure. The sealing member includes a brazing metal containing a filler.
Claims15
A microstructure apparatus comprising:
- a first substrate having a surface on which a microstructure is disposed;
- a second substrate having a surface opposing the microstructure;
- and
- a sealing member that bonds the opposing surfaces of the first substrate and the second substrate and that encloses and seals the microstructure,
- the sealing member comprising a brazing metal containing a filler.
2 more elements
15-23. (canceled)
Dependencies are inferred from the claim text.