Heat dissipation device
AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.
InventorsChing-Hung Chu, Chang-Mu Li
Life of this patent
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Abstract
A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively.
Claims18
A heat dissipation device comprising:
- a heat sink comprising a base and a plurality of fins extending upwardly from a top surface of the base, and two engaging portions protruding from two fins, respectively, and towards each other;
- and
- an elongated label member fixed on the fins of the heat sink, two flanges angling outwardly from two opposite lateral sides of the label member and clasping the two engaging portions of the heat sink, respectively.
A heat dissipation device comprising:
- a heat sink comprising a base and a plurality of fins extending upwardly from a top surface of the base, the fins comprising two spaced first fins and a plurality of second fins located between the two first fins, two elongated engaging portions extending from the two first fins, respectively, and towards each other;
- and
- an elongated label member disposed on the second fins of the heat sink, the two engaging portions pressing two opposite lateral ends of the label member downward, respectively.
Dependencies are inferred from the claim text.