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US 2010/0059202 A1Published application
Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsWei Li, Yi-Qiang Wu
Life of this patent
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Abstract
A heat dissipation device cooling an electronic device comprises a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device.
Claims15
A heat dissipation device for cooling an electronic device, comprising:
- a conductive plate;
- a heat spreader received in the conductive plate and comprising a first face for contacting the electronic device and a second face opposite to the first face;
- a heat pipe contacting the conductive plate and comprising an evaporating section received in the conductive plate and located between the first face and the second face of the heat spreader;
- and
- an elastic member mounted on the conductive plate for exerting an elastic force on the heat spreader and the heat pipe in the conductive plate toward the electronic device.
2 more elements
A heat dissipation device, comprising:
- a conductive plate;
- a heat spreader for engaging with an electronic device to absorb heat therefrom, being received in a hole defined in the conductive plate;
- a heat pipe with a first end received in heat spreader and thermally connecting at least with a bottom wall of the heat spreader;
- and
- an elastic member secured to the conductive plate and depressing heat spreader and the first end of the heat pipe for pushing the heat spreader and the first end of the heat pipe downwardly toward the electronic device.
2 more elements
Dependencies are inferred from the claim text.