Method of manufacturing ink-jet recording head

A method of manufacturing an ink-jet recording head including a pair of recording element substrates being adjacent to each other and having at least one nozzle array comprising a plurality of nozzles to eject ink, an electric wiring member arranged to supply signals to the pair of recording element substrates, a supporting member arranged to support the pair of recording element substrates and the electric wiring member, electric connecting portions disposed between the recording element substrates and the electric wiring member, and a sealant sealing the electric connecting portions, the method comprising the steps of:

• measuring a positional deviation of each of the recording element substrates at a position near each end thereof, the deviation being generated due to thermal deformations of the recording element substrate and the sealant;
• and
• mounting the pair of recording element substrates to the supporting member, forming the electric connecting portions, applying the sealant to the electric connecting portions, and sealing the electric connecting portions with the applied sealants by heating and cooling the sealants,
• wherein the pair of recording element substrates are mounted to the supporting member in the mounting step such that the position of each of the recording element substrates near each end thereof is set to be shifted in amount corresponding to the positional deviation measured in the measuring step.

A method of manufacturing an ink-jet recording head including a plurality of recording element substrates each having at least one ejection orifice array comprising a plurality of ejection orifices to eject ink, an electric wiring member arranged to supply signals to the plurality of recording element substrates, a supporting member arranged to support the plurality of recording element substrates and the electric wiring member, electric connecting portions electrically interconnecting the recording element substrates and the electric wiring member, and a sealant sealing the electric connecting portions, the method comprising the steps of:

• mounting the plurality of recording element substrates to the supporting member depending on a difference between an interval of two reference positions on each of the recording element substrates disposed on the supporting member before curing of the sealant and an interval of the two reference positions after the curing of the sealant, the difference being measured in advance, such that positions of the ejection orifices at respective ends of the ejection orifice arrays in adjacent two of the plurality of recording element substrates, on the side where the respective ends are positioned close to each other, are shifted in a direction of the ejection orifice array;
• electrically connecting the electric wiring member and the recording element substrates to each other;
• and
• applying the sealant to the electric connecting portions and curing the applied sealant by heating the sealant.