Heat insulating mold, mold component, molding machine, and method for manufacturing heat insulating mold
AssigneeSumitomo Heavy Industries, Ltd.
InventorToru Hirata
Life of this patent
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AssigneeSumitomo Heavy Industries, Ltd.
InventorToru Hirata
Estimating the term…
An object is to shorten molding cycle and improve durability of a heat-insulating layer (25). A heat-insulating mold comprises a mold plate and a transfer member attached to the mold plate and comprising a transfer surface on a surface which faces a cavity (C1, C2), the transfer surface comprising fine projections and depressions formed in a predetermined pattern. A heat-insulating layer (25) whose surface is densified is formed on a surface of the mold plate which surface comes into contact with the transfer member. Since the heat-insulating layer (25) is formed on a surface of the mold plate which surface comes into contact with the transfer member, the temperature of a molding material charged into the cavity (C1, C2) is temporarily maintained by the heat-insulating layer (25). As a result, formation and growth of a surface-hardened layer can be delayed, and transfer of the pattern of the transfer surface can be completed before the formation and growth of the surface-hardened layer. Since the surface of the heat-insulating layer (25) is densified, the surface of the heat-insulating layer (25) can be made very smooth. The durability of the heat-insulating layer (25) can be enhanced.
A heat-insulating mold comprising:
A mold component which is disposed on the back side of a transfer member comprising a transfer surface comprising projections and depressions formed in a predetermined pattern, wherein
A method of manufacturing a heat-insulating mold comprising a mold plate, and a transfer member attached to the mold plate and having a transfer surface on a surface which faces a cavity, the transfer surface comprising fine projections and depressions formed in a predetermined pattern, the method comprising the step of forming a heat-insulating layer whose surface is densified on a surface of the mold plate which surface comes into contact with the transfer member.
Dependencies are inferred from the claim text.