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US 2010/0025091 A1Published application
Printed Circuit Boards
AssigneeSemblant Global Limited
InventorsFrank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
Life of this patent
Estimating the term…
Abstract
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Claims85
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A printed circuit board, comprising:
- a substrate comprising an insulating material;
- a plurality of conductive tracks attached to at least one surface of the substrate;
- a coating deposited on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer;
- and
- at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the coating such that the solder joint abuts the coating.
2 more elements
The printed circuit board of 32, wherein:
- the particular electrical component is wire bonded to the at least one conductive track by a wire coated with the coating;
- and
- the wire bond is formed without first removing the coating from the wire.
A method, comprising:
- attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material;
- depositing a coating on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer;
- and
- after depositing the coating, soldering through the coating to form a solder joint between an electrical component and at least one conductive track attached to the substrate, the solder joint abutting the coating.
1 more element
A printed circuit board, comprising:
- a substrate comprising an insulating material;
- a plurality of conductive tracks attached to at least one surface of the substrate;
- and
- a coating deposited on the plurality of conductive tracks such that there is essentially no solder between the coating and the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer that allows a connection to be soldered through the coating to at least one conductive track without first removing the coating from the at least one conductive track.
1 more element
A method, comprising:
- forming a substrate comprising an insulating material;
- forming a plurality of conductive tracks on at least one surface of the substrate to form a printed circuit board;
- and
- prior to soldering one or more components to the plurality of conductive tracks, depositing a coating on the at least one surface of the substrate, wherein the coating:
- protects the plurality of conductive tracks from oxidation;
- and
- comprises at least one halo-hydrocarbon polymer that allows a connection to be soldered through the coating to at least one conductive track without first removing the coating from the at least one conductive track.
4 more elements
An apparatus, comprising:
- a substrate;
- a coating deposited on at least one surface of the substrate, the coating comprising at least one halo-hydrocarbon polymer;
- at least one metal contact between the substrate and the coating;
- and
- at least one electrical component connected by a solder joint to the at least one metal contact, wherein the solder joint is soldered through the coating such that the solder joint abuts the coating.
2 more elements
Dependencies are inferred from the claim text.