Method for making smart cards capable of operating with and without contact
AssigneeGemplus
InventorsStephane Ayala, Gerard Bourneix, Christine Beausoleil, David Martin, Laurent Oddou, Philippe Patrice, Michael Zafrany
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Abstract
The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.
Claims10
A support sheet, comprising:
- an antenna winding with at least two turns, a pair of connection pads both disposed on a common side of said antenna winding, an insulating material covering a zone across said antenna winding, and a conductive element on said insulating material that connects an end of said winding on a side opposite said common side to one of said connection pads.
A support sheet, comprising:
- an antenna winding with at least two turns and a pair of ends that are respectively associated with two connection points located on a common side of said turns, said antenna being incrusted on said sheet and including a link that crosses said turns to connect a terminating one of said turns to one of said connection points, with said link being insulated from said turns to avoid a short circuit.
A method for manufacturing smart cards, comprising the following steps:
- providing a support sheet having an antenna with a plurality of turns, a pair of connection pads disposed on a common side of said turns, and a link crossing said turns that connects the opposite side of said turns to one of said connection pads;
- laminating said support sheet between a pair of plastic sheets;
- machining a cavity in one of said plastic sheets subsequent to said laminating step to expose said connection pads;
- and
- placing an integrated circuit chip within said cavity so as to be in electrical contact with said connection pads.
Dependencies are inferred from the claim text.