Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsYohko Sano, Mihoko Matsutani, Kazuyoshi Fujita
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AssigneeSumitomo Bakelite Co., Ltd.
InventorsYohko Sano, Mihoko Matsutani, Kazuyoshi Fujita
Estimating the term…
The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.
An organic insulating material comprising a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit, wherein the prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography.
Dependencies are inferred from the claim text.