Back to results
US 2010/0000755 A1Published application
Enclosure
AssigneeFujitsu Limited
InventorYasushi YUI
Life of this patent
Estimating the term…
Abstract
An enclosure includes a main body, a metal plate, an adhesive agent and a metal-plated film. The main body is formed of resin material. The metal plate covers the back surface of the main body. The adhesive agent is provided between the main body and the metal plate. The metal-plated film is formed on the front surface of the main body and electrically connected to the metal plate.
Claims12
An enclosure comprising:
- a main body that is formed of resin material;
- a metal plate that covers the back surface of the main body;
- an adhesive agent that is provided between the main body and the metal plate;
- and
- a metal-plated film that is formed on the front surface of the main body and electrically connected to the metal plate.
2 more elements
A method of manufacturing an enclosure, comprising:
- disposing a metal plate in a mold, the front surface of the metal plate being coated with an adhesive agent;
- pouring molten resin material into the metal mold;
- cooling the resin material within the metal mold to form a main body;
- and
- coating a metal-plated film on the front surface of the main body.
2 more elements
Dependencies are inferred from the claim text.