Method for manufacturing electron emitting device and memory medium or recording medium therefor

A memory medium for the manufacturing of an electron emitting device, comprising a control program for executing:

• a first step of preparing a first substrate disposed with phosphors and disposing the first substrate in a vacuum or reduced pressure atmosphere;
• a second step of disposing an electron emitting base member on a second substrate;
• a third step of depositing sputtered particles on the second substrate subjected to said second step by a sputtering method using a target having a low work function substance inside a vacuum or reduced pressure atmosphere;
• a fourth step of disposing a mask for screening a first region of the second substrate including said electron emitting base member and opening a second region of the second substrate not including said electron emitting base member, in a state in which a vacuum or reduced pressure atmosphere is maintained from said third step;
• a fifth step of etching a deposition of the low work function substance on the second substrate subjected to said fourth step, in a state in which the vacuum or reduced pressure atmosphere is maintained from said fourth step;
• and
• a sixth of making the first substrate subject to said first step opposite the second substrate subjected to said fifth step and sealing the first substrate and the second substrate by a sealing agent to fabricate a vacuum or reduced pressure chamber, in a state in which the vacuum or reduced pressure atmosphere is maintained from said first step and said fifth step.

A recording medium for the manufacturing of an electron emitting device, comprising a control program for executing:

• a first step of preparing a first substrate disposed with phosphors and disposing the first substrate in a vacuum or reduced pressure atmosphere;
• a second step of disposing an electron emitting base member on a second substrate;
• a third step of depositing sputtered particles on the second substrate subjected to said second step by a sputtering method using a target having a low work function substance inside the vacuum or reduced pressure atmosphere;
• a fourth step of disposing a mask for screening a first region of the second substrate including said electron emitting base member and opening a second region of the second substrate not including said electron emitting base member, in a state in which the vacuum or reduced pressure atmosphere is maintained from said third step;
• a fifth step of etching a deposition of the low work function substance on the second substrate subjected to said fourth step, in a state in which the vacuum or reduced pressure atmosphere is maintained from said fourth step;
• and
• a sixth step of making the first substrate subjected to said first step opposite the second substrate subjected to said fifth step and sealing the first substrate and the second substrate by a sealing agent to fabricate a vacuum or reduced pressure chamber, in a state in which the vacuum or reduced pressure atmosphere is maintained from said first step and said fifth step.