Tape application method and tape application device
AssigneeKUKA Systems GmbH
InventorsFrank Herz, Wolfgang Semmlinger, Jürgen Liepert
Life of this patent
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Abstract
A method and device (1) are provided for applying laminated tapes (2, 3) with an adhesive tape (2) and a cover tape (3) on a surface (4). The tape application device (1) includes a frame (5), a tape winder (8) for the laminated tape (2, 3), a tape winder (9) for the pulled-off cover tape (3), a tape guide (14) and a pressure-exerting device (18) for pressing the adhesive tape (2) onto a surface (4). During application, the cover tape (3) is at some parts detached and guided away from the adhesive tape (2), wherein the adhesive tape (2) can be severed at the detachment point and can be pressed onto the surface (4) with two closely adjacent pressing elements (19, 20).
Claims31
A method for applying multilayer tapes, the method comprising:
- applying at least an adhesive tape and a cover tape, to a substrate by means of a tape applicator
- separating the cover tape from the adhesive tape in places during application and
- leading away the separated cover tape;
- and
- cutting through the adhesive tape at the site of separation.
A tape applicator for multilayer tapes, comprising:
- a multilayer tape with at least one adhesive tape and a cover tape;
- a frame;
- a tape roll for the multilayer tape;
- a tape guide for pulled-off cover tape;
- a tape guide;
- and
- a pressing device for pressing the adhesive tape onto a substrate, wherein the pressing device has two pressing elements located at closely spaced locations from one another.
Dependencies are inferred from the claim text.