Method and system for composite bond wires
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChris Wyland
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Abstract
Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals.
Claims15
For use in an integrated circuit, a composite bond wire electrically connecting components of the integrated circuit, the composite bond wire comprising:
- a material having an electrical resistance and used to form an inner portion;
- and
- a conductive material having a lower electrical resistance than the inner portion and used to form an outer layer surrounding the inner portion.
A method for producing a composite bond wire for use in an integrated circuit, the method comprising:
- melting a conductive material;
- mixing a material of particles less than 100 micrometers in size with the conductive material to create a mixture;
- and
- creating the composite bond wire from the mixture.
Dependencies are inferred from the claim text.