A composite material for an electric and electronic component formed through a punching process followed by a bending process, comprising:
- one layer of an insulating film disposed on at least a part of a metallic base material;
- and
- a metal layer disposed between the metal base material and the insulating film so that the insulating film has a peel width of less than 10 μm at an end thereof after the punching process, and an adhesion state of the insulating film at a bending inner side thereof and an adhesion state of the insulating film at a bending outer side thereof are maintained after the bending process.