Pressure-sensitive adhesive composition and use thereof
AssigneeNitto Denko Corporation
InventorsMasayuki OKAMOTO, Masahito NIWA, Naoaki HIGUCHI
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AssigneeNitto Denko Corporation
InventorsMasayuki OKAMOTO, Masahito NIWA, Naoaki HIGUCHI
Estimating the term…
The present invention relates to a pressure-sensitive adhesive composition used for a pressure-sensitive adhesive sheet to be directly attached to a metal surface, the composition including, a monomer mixture or an acrylic copolymer material obtained by at least partially polymerizing the monomer mixture, the monomer mixture including: at least one monomer (monomer m1) selected from alkyl(meth)acrylates represented by the following formula (I): CH2═C(R1)COOR2 in which R1 is a hydrogen atom or a methyl group, and R2 is an alkyl group having 1 to 20 carbon atoms, and N-methylol (meth)acrylamide (monomer m2); in which the monomer m1 and the monomer m2 are contained in a total amount of 60% by weight or more based on the total amount of the monomer mixture, and the monomer mixture includes substantially no carboxyl group-containing monomer.
A pressure-sensitive adhesive composition used for a pressure-sensitive adhesive sheet to be directly attached to a metal surface, said composition comprising, as a main ingredient, a monomer mixture or an acrylic copolymer material obtained by at least partially polymerizing the monomer mixture,
A method for producing a pressure-sensitive adhesive sheet to be directly attached to a metal surface, said method comprising:
Dependencies are inferred from the claim text.