Light-emitting device including reflective layer formed with curved surface and manufacturing method thereof
AssigneeKorea University Industrial & Academic Collaboration Foundation
InventorsTae-Geun Kim, Wan-Ho Lee
Life of this patent
Estimating the term…
Abstract
A flip-chip type light-emitting device and manufacturing method thereof provides a curved surface formed on the transparent electrode layer and a reflective layer transferred with the curved surface of the transparent electrode layer is additionally formed on the transparent electrode layer, so that the light generated from the active layer is incident to the reflective layer through the p-type nitride layer and the transparent electrode layer, and then is reflected from the curved surface of the reflective layer so as to exhibit an effect of extracting a larger amount of light in a vertical direction as compared to the conventional light-emitting device.
Claims8
A method of fabricating a light-emitting device, comprising the steps of:
- (a) forming a light-emitting layer on a substrate so as to emit light;
- (b) forming a transparent electrode layer on the light-emitting layer, the transparent electrode layer having curved surface formed thereon;
- and
- (c) forming a reflective layer on the transparent electrode layer in such a fashion that the curved surface formed on the transparent electrode layer is transferred.
A light-emitting device comprising:
- a substrate;
- a light-emitting layer formed on a substrate so as to emit light;
- a transparent electrode layer formed on the light-emitting layer, the transparent electrode layer having curved surface formed on the top surface thereof;
- and
- a reflective layer formed on the transparent electrode layer in such a fashion that the curved surface formed on the transparent electrode layer is transferred so as to reflect the light generated from the light-emitting layer toward the light-emitting layer.
Dependencies are inferred from the claim text.