Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
AssigneeInternational Business Machines Corporation
InventorJohn U. Knickerbocker
Life of this patent
Estimating the term…
Abstract
An electronic apparatus includes an electronic component electrically connected to a substrate positioned beneath the electronic component. A member includes a plurality of decoupling capacitors having different voltages, and the decoupling capacitors are electrically connected to the electronic component. A plurality of voltage planes in the member are electrically connected to the decoupling capacitors. The decoupling capacitors, via the voltage planes in the member, provide different voltages to the voltage planes and thus the electronic component.
Claims18
An electronic apparatus, comprising:
- at least one electronic component electrically connected to at least one substrate positioned beneath the at least one electronic component;
- and
- at least one member including a plurality of decoupling capacitors being segmented to support different voltages on the electronic component, and the decoupling capacitors being electrically connected to the at least one electronic component.
A system for supplying a specified voltage to an electronic component, comprising:
- at least one electronic component electrically connected to at least one substrate positioned beneath the at least one electronic component;
- at least one member including a plurality of decoupling capacitors having segmentation in order to support different voltages;
- and
- a plurality of voltage planes or segmentation within voltage planes in the at least one member and the decoupling capacitors being electrically connected to the electronic component via the voltage planes in the member for supporting different voltages to the voltage planes and the electronic component.
A method for supplying a specified voltage to an electronic component, comprising:
- electrically connecting a plurality of electronic components to at least one substrate;
- electrically connecting a plurality of members to at least one of the plurality of electronic components;
- providing decoupling capacitors in each of the members, and each of the decoupling capacitors supporting one or more different voltage levels;
- electrically connecting each of the decoupling capacitors to selected electronic components;
- and
- supplying a specified voltage to the electronic components using corresponding decoupling capacitors.
Dependencies are inferred from the claim text.