Bonded Wafer Package Module
AssigneeMaxim Integrated Products, Inc.
InventorsHans Dropmann, Uppili Sridhar, Carlton Stuebing
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Abstract
Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices, the bonded wafers being diced to form individual sealed devices. The devices may be duplexers, interstage filters or other circuits such as VCOs and RF circuits. Various embodiments are disclosed.
Claims38
A bonded wafer package comprising:
- first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices;
- the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices;
- the bonded wafers being diced to form individual sealed devices.
A bonded wafer package comprising:
- first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices thereon forming duplexers, including a plurality of BAW resonators within each of the sealed devices, inductors for the duplexers being formed by conductive traces on one surface of the bonded wafer package;
- the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices;
- the bonded wafers being diced to form individual sealed devices.
Dependencies are inferred from the claim text.