A process of electronic manufacturing comprising integrating on a single semiconductor integrated circuit chip a transistor-based RF (radio frequency) power amplifier having balanced outputs, a transistor-based receiver RF amplifier having balanced inputs ohmically connected to the balanced outputs respectively of said RF power amplifier, and a balun having a primary and a secondary, said primary having primary connections and a supply connection of said primary intermediate said primary connections and said primary connections ohmically connected switchlessly both to said balanced outputs of said RF power amplifier respectively and to said balanced inputs of said receiver RF amplifier.