Process condition evaluation method for liquid crystal display module

A process condition evaluation method for a liquid crystal display module (LCM), comprising:

• a first step of obtaining a thermal resistance coefficient measuring pattern, an analysis sample for a cell bonding status in an LCM fabrication process, and obtaining a lower substrate sample by separating an upper substrate from the thermal coefficient measuring pattern;
• a second step of supplying voltages on a gate pad on the lower substrate sample with sequentially increasing a voltage level by a predetermined unit by using an electrical device, and measuring currents at a drain pad whenever voltage increased by a predetermined unit is applied to the gate pad, thereby repeatedly obtaining resistance values based on the voltages and the currents to obtain an average resistance value;
• and
• a third step of obtaining the average resistance value by changing the temperature, and obtaining a thermal resistance coefficient based on a temperature difference and the average resistance value.