Pogo probe, probe socket, and probe card

A probe socket, provided with a plurality of pogo probes, comprising a bottom surface for contacting a semiconductor device under test for chip scale package and a top surface having a shoulder portion for contact with a printed circuit board, characterized in that:

• each of the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions respectively with a first probe head and a second probe head, wherein each of the first and second probe heads is composed of a plurality of taper members to form a crown shape and each of the taper members has an individual chamfer;
• the probe socket has a recessed portion in its center, wherein the recessed portion has a bottom portion provided with a plurality of first through holes penetratable by the first probe heads of the pogo probes for contact with contact pads of the semiconductor device under test;
• a pressing element is disposed in the recessed portion and provided with a plurality of second through holes penetratable by the second probe heads of the pogo probes for contact with the printed circuit board so as to maintain a preloaded state;
• and
• the shoulder portion of the probe socket is lower than the second probe heads to allow the printed circuit board to abut against the shoulder portion of the probe socket, so as to define a reference plane for the second probe heads of the pogo probes.

A probe card comprising a test substrate and at least one probe socket having a plurality of pogo probes, characterized in that:

• each said pogo probe has a hollow main body receiving at least one resilient element internally and the main body comprises two end portions respectively with a first probe head and a second probe head, wherein each of the first and second probe heads is composed of a plurality of taper members to form a crown shape and each of the taper members has an individual chamfer;
• the probe socket has a recessed portion in its center, wherein the recessed portion has a bottom portion provided with a plurality of first through holes penetratable by the first probe heads of the pogo probes for contact with contact pads of the semiconductor device under test for chip scale package;
• a pressing element is disposed in the recessed portion and provided with a plurality of second through holes penetratable by the second probe heads of the pogo probes for contact with the printed circuit board so as to maintain a preloaded state;
• and
• the probe socket has a shoulder portion on its top formed to allow the test substrate to be attached on the shoulder portion accurately and thereby form a reference plane for the second probe heads, such that the preloaded state and the reference plane further allow the first probe heads of the pogo probes to be aligned with a common plane for contact with the semiconductor device under test for chip scale package.