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US 2009/0289650 A1Published application
Probe card and method for selecting the same
AssigneeKabushiki Kaisha Toshiba
InventorKazuhito Hayasaka
Life of this patent
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Abstract
A probe card includes a probe unit having multiple through holes arranged therein, multiple probe needles respectively press-fitted to the multiple through holes, a printed board having convex portions which presses down the probe needles located in predetermined positions, and a unit holder which supports the probe unit and the printed board.
Claims18
A probe card comprising:
- a probe unit having a plurality of through holes arranged therein;
- a plurality of probe needles respectively press-fitted to the plurality of through holes;
- a printed board having a convex portion which presses down any of the probe needles located in a predetermined position;
- and
- a unit holder which supports the probe unit and the printed board.
2 more elements
A probe card comprising:
- a probe unit having a plurality of through holes arranged therein;
- a plurality of probe needles respectively press-fitted to the plurality of through holes;
- a printed board electrically connected to the probe needles;
- and
- a contact mask having an aperture in a region thereof corresponding to any of the probe needles located in a predetermined position.
2 more elements
A method for selecting a probe card comprising;
- inputting pad coordinates P (x, y) of a test target chip;
- inputting pad sizes (xPad, yPad) of the test target chip;
- calculating the number of x-direction pad pitches counted from a base point pad of the test target chip;
- calculating the number of y-direction pad pitches counted from the base point pad of the test target chip;
- calculating an x-direction pitch difference dx=(the number of through hole pitches of a currently selected probe card×Nx)−(the number of x-direction pad pitches counted from a base point pad), where Nx is an integer starting from 1;
- judging whether or not the x-direction pitch difference dx is below 0;
- incrementing the Nx value when the x-direction pitch difference dx is not less than 0, and calculating the x-direction pitch difference dx again;
- judging, when the x-direction pitch difference dx is below 0, whether or not a minimum value of an absolute value of the x-direction pitch difference dx is not more than xPad/2, the x-direction pitch difference dx obtained by a calculation based on the Nx value;
- calculating a y-direction pitch difference dy=(the number of through hole pitches of a currently selected probe card×Ny)−(the number of y-direction pad pitches counted from the base point pad);
- judging whether or not the y-direction pitch difference dy is below 0;
- incrementing the Ny value when the y-direction pitch difference dy is not less than 0, and calculating the y-direction pitch difference dy again;
- judging, when the y-direction pitch difference dy is below 0, whether or not a minimum value of an absolute value of the y-direction pitch difference dy is not more than yPad/2, the y-direction pitch difference dy obtained by a calculation based on the Ny value;
- and
- selecting a different probe card when the minimum value of the absolute value of the x-direction pitch difference dx is judged to be more than xPad/2 or when the minimum value of the absolute value of the y-direction pitch difference dy is judged to be more than yPad/2.
11 more elements
A method for selecting a probe card comprising:
- inputting pad coordinates P (x, y) of a test target chip;
- expanding the pad coordinates P (x, y) of the test target chip to coordinates of all pads in all test target chips located on a wafer surface;
- calculating a difference dx between an x coordinate of a P-th pad on the wafer surface and an x coordinate of a TH-th through hole on the wafer surface;
- calculating a difference dy between a y coordinate of the P-th pad on the wafer surface and a y coordinate of the TH-th through hole on the wafer surface;
- judging whether or not the through hole TH currently being calculated is a last through hole THn in a probe card;
- incrementing a value TH when the through hole TH currently being calculated is judged not to be the last through hole THn in the probe card, and calculating dx and dy again;
- judging, when the through hole TH currently being calculated is judged to be the last through hole THn in the probe card, whether or not a pad P currently being calculated is a last pad Pn on the wafer surface;
- when the pad P currently being calculated is judged to be the last pad Pn on the wafer surface, obtaining a value dx of a minimum absolute value (dxmin) from among all the pads on the test target chips on the wafer surface;
- obtaining a value dy of a minimum absolute value (dymin) from among all the pads on the test the target chips on the wafer surface;
- judging whether or not dxmin obtained for each of the pads is not more than xPad/2 and dymin obtained for each of the pads is not more than yPad/2, where the xPad and the yPad are pad sizes of the test target chip;
- and
- selecting a different probe card when dxmin is judged to be more than xPad/2 and when dymin is judged to be more than yPad/2.
9 more elements
Dependencies are inferred from the claim text.