Methods And Apparatus For Multi-Modal Wafer Testing

Abstract

Access to integrated circuits of a wafer for concurrently performing two or more types of testing, is provided by bringing a wafer and an edge-extended wafer translator into an attached state. The edge-extended wafer translator having wafer-side contact terminals and inquiry-side contact terminals disposed thereon, a first set of wafer-side contact terminals being electrically coupled to a first set of inquiry-side contact terminals, and a second set of wafer-side contact terminals being electrically coupled to a second set of inquiry-side contact terminals. The edge-extended wafer translator having a central portion generally coextensive with the attached wafer, and an edge-extended portion extending beyond the boundary generally defined by the outer circumferential edge of the wafer. A first set of pads of at least one integrated circuit is electrically coupled to the first set of wafer-side contact terminals, and a second set of pads of the integrated circuit is electrically coupled to the second set of wafer-side contact terminals. The edge-extended wafer translator may be shaped such that its edge-extended portion is not coplanar with the central portion thereof.

Dependencies are inferred from the claim text.