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US 2009/0289499 A1Published application
Prevention of the propagation of power supply noise from one output circuit to another in a semiconductor device
AssigneeElpida Memory, Inc.
InventorsTakenori Sato, Hiroki Fujisawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device is disclosed. A first power supply wiring for connecting between a first output circuit consisting of a predetermined number of output circuits and a first power supply pad which corresponds to the first output circuit, is connected via a resistor with a second power supply wiring for connecting between a second output circuit consisting of a predetermined number of output circuit and a second power supply pad which corresponds to the second output circuit. Thus, power supply noise that is to be propagated to certain output circuits via in-chip output power supply wirings can be reduced.
Claims18
A semiconductor device, comprising:
- a semiconductor chip including individually independent power supply wirings supplying a power supply voltage to a plurality of output circuits, and power supply pads to be connected to said power supply wirings;
- and
- a substrate having a plurality of external power supply terminals each connected with said respective power supply pads, wherein said semiconductor chip is to be mounted on said substrate,
- wherein said semiconductor chip includes:
- a first output circuit made up of a predetermined number of said output circuits;
- a first power supply pad which is said power supply pad and which corresponds to said first output circuit;
- a first power supply wiring which is said independent power supply wiring, and connecting between said first output circuit and said first power supply pad;
- a second output circuit made up of a predetermined number of said output circuits;
- a second power supply pad which is said power supply pad and which corresponds to said second output circuit;
- a second power supply wiring which is said independent power supply wiring, and connecting between said second output circuit and said second power supply pad;
- a resistor having a predetermined value, and connecting between said first power supply wiring and said second power supply wiring;
- wherein said substrate includes:
- a first wiring connecting said first power supply pad and one of said external power supply terminals with each other;
- a second wiring connecting said second power supply pad and said one external power supply terminal with each other, said second wiring being independent of said first wiring;
- and
- wherein said first wiring and second wirings are connected together in the vicinity of said one external power supply terminal.
13 more elements
A semiconductor device, comprising
- a semiconductor chip including individually independent power supply wirings supplying a power supply voltage to a plurality of output circuits, and power supply pads to be connected to said power supply wirings;
- and
- a substrate having a plurality of external power supply terminals each connected with respective said power supply pads, wherein said semiconductor chip is to be mounted on said substrate,
- wherein said semiconductor chip includes:
- a first output circuit made up of a predetermined number of said output circuits;
- a first power supply pad which is said power supply pad and which corresponds to said first output circuit;
- a first power supply wiring which is said independent power supply wiring, and connecting between said first output circuit and said first power supply pad;
- a second output circuit made up of a predetermined number of said output circuits;
- a second power supply pad which is said power supply and which corresponds to said second output circuit;
- a second power supply wiring which is said independent power supply wiring, and connecting between said second output circuit and said second power supply pad;
- a resistor having a predetermined value and connecting between said first power supply wiring and said second power supply wiring.
8 more elements
A semiconductor device, comprising a substrate and a semiconductor chip mounted on the substrate:
- the semiconductor chip comprising:
- first and second circuits;
- first and second power supply pads;
- first and second power supply wirings, the first power supply wiring electrically connecting the first power supply pad to the first circuit and the second power supply wiring electrically connecting the second power supply pad to the second circuit;
- and
- a resistor coupled between the first power supply wiring and the second power supply wiring;
- and
- the substrate comprising:
- an electrical path supplying a power voltage to each of the first and second power supply pads of the semiconductor chip.
6 more elements
Dependencies are inferred from the claim text.