Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of ic during pressing

A method of forming an electronic assembly, comprising:

• identifying a plurality of IC die each having a plurality of solder bump comprising bonding terminals and a workpiece, said workpiece comprising a plurality of workpiece contact pads, said plurality of workpiece contact pads having an elevated ring having a ring height that is at least 10 μm above a minimum contact pad height in an indented bonding region within said elevated ring;
• mounting said plurality said IC die on a surface of said workpiece to align said plurality of bonding terminals to said plurality of workpiece contact pads;
• applying heat so that said solder becomes tacky while remaining below its melting temperature to obtain a tacked position for said plurality of solder bumps terminals relative to said plurality of workpiece contact pads, and
• pressing said plurality of said IC die using a pressing tool, wherein said solder bumps are heated to a peak temperature that is above said melting temperature, and wherein said elevated ring resists horizontal movement of said plurality of IC die from said tacked position during said pressing,
• wherein said plurality of bonding terminals include a tip region having a tip area, and said indented bonding region provides an area of sufficient dimension so that after said pressing a distal end of said tip region is within said indented bonding region and extends at least 10 μm below a top of said elevated ring.